Author: Butz, B.
Paper Title Page
SUPFDV012 The Development of HiPIMS Multilayer SIS Film Coatings on Copper for SRF Applications 86
 
  • S.B. Leith, X. Jiang, A.O. Sezgin, M. Vogel
    University Siegen, Siegen, Germany
  • B. Butz, Y. Li, J. Müller
    MNaF, Siegen, Germany
  • S. Keckert, J. Knobloch, O. Kugeler, D.B. Tikhonov
    HZB, Berlin, Germany
  • J. Knobloch
    University of Siegen, Siegen, Germany
  • R. Ries, E. Seiler
    Slovak Academy of Sciences, Institute of Electrical Engineering, Bratislava, Slovak Republic
 
  Funding: Authors acknowledge both the EASITrain, Marie Sklodowska-Curie Action (MSCA) Innovative Training Network (ITN), Grant Agreement no. 764879 and the ARIES collaboration, Grant Agreement no. 730871
In recent years, the use of alternatives to bulk Nb in the fabrication of SRF cavities, including novel materials and/or fabrication techniques, have been extensively explored by the SRF community. One of these new methodologies is the use of a superconductor-insulator-superconductor (SIS) multilayer structure. Typically, these have been envisaged for use with bulk Nb cavities. However, it is conceivable to combine the benefits of SIS structures with the benefits of coated Cu cavities. It is also clear that the use of energetic deposition techniques such as high power impulse magnetron sputtering (HiPIMS), provide significant benefits over typical DC magnetron sputtering (MS) coatings, in terms of SRF performance. In light of this, two series of multilayer SIS film coatings, with a Nb-AlN-NbN structure, were deposited onto electropolished OFHC Cu samples, with the use of HiPIMS, in order to determine the efficacy of this approach. This contribution details the development of these coatings and the required optimization of the coating parameters of the separate material systems, through the use of multiple material and superconducting characterization techniques.
 
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DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-SRF2021-SUPFDV012  
About • Received ※ 20 June 2021 — Accepted ※ 21 December 2021 — Issue date; ※ 27 April 2022  
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